Download the fantastic book titled Microelectronic Interconnections and Assembly written by G.G. Harman, available in its entirety in both PDF and EPUB formats for online reading. This page includes a concise summary, a preview of the book cover, and detailed information about "Microelectronic Interconnections and Assembly", which was released on 06 December 2012. We suggest perusing the summary before initiating your download. This book is a top selection for enthusiasts of the Technology & Engineering genre.
Summary of Microelectronic Interconnections and Assembly by G.G. Harman PDF
MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.
Detail About Microelectronic Interconnections and Assembly PDF
- Author : G.G. Harman
- Publisher : Springer Science & Business Media
- Genre : Technology & Engineering
- Total Pages : 295 pages
- ISBN : 9401151350
- Release Date : 06 December 2012
- PDF File Size : 42,5 Mb
- Language : English
- Rating : 4/5 from 21 reviews
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