Microelectronic Interconnections and Assembly Book [PDF] Download

Download the fantastic book titled Microelectronic Interconnections and Assembly written by G.G. Harman, available in its entirety in both PDF and EPUB formats for online reading. This page includes a concise summary, a preview of the book cover, and detailed information about "Microelectronic Interconnections and Assembly", which was released on 06 December 2012. We suggest perusing the summary before initiating your download. This book is a top selection for enthusiasts of the Technology & Engineering genre.

Summary of Microelectronic Interconnections and Assembly by G.G. Harman PDF

MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations were given in eight technical sessions at the Workshop. A list of these sessions and their chairpersons is attached below. The Workshop was devoted to the technical aspects of advanced interconnections and microassembly, but also included papers on the education issues required to prepare students to work in these areas. In addition to new technical developments, several papers presented overviews predicting the future directions of these technologies. The basic issue is that electronic systems will continue to be miniaturized and at the same time performance must continue to improve. Various industry roadmaps were discussed as well as new smaller packaging and interconnection concepts. The newest chip packages are often based on the selection of an appropriate interconnection method. An example is the chip-scale package, which has horizontal (x-y) dimensions,;; 20% larger than the actual silicon chip itself. The chip is often flip-chip connected to a micro ball-grid-array, but direct chip attach was described also. Several papers described advances in the manufacture of such packages.


Detail About Microelectronic Interconnections and Assembly PDF

  • Author : G.G. Harman
  • Publisher : Springer Science & Business Media
  • Genre : Technology & Engineering
  • Total Pages : 295 pages
  • ISBN : 9401151350
  • PDF File Size : 42,5 Mb
  • Language : English
  • Rating : 4/5 from 21 reviews

Clicking on the GET BOOK button will initiate the downloading process of Microelectronic Interconnections and Assembly by G.G. Harman. This book is available in ePub and PDF format with a single click unlimited downloads.

GET BOOK

Microelectronic Interconnections and Assembly

Microelectronic Interconnections and Assembly
  • Publisher : Springer Science & Business Media
  • File Size : 32,6 Mb
  • Release Date : 06 December 2012
GET BOOK

MICROELECTRONIC INTERCONNECTIONS AND MICROASSEMBL Y WORKSHOP 18-21 May 1996, Prague, Czech Republic Conference Organizers: George Harman, NIST (USA) and Pavel Mach (Czech Republic) Summary of the Technical Program Thirty two presentations

Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections
  • Publisher : Springer Science & Business Media
  • File Size : 27,9 Mb
  • Release Date : 24 April 2007
GET BOOK

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies

Handbook of Lead-Free Solder Technology for Microelectronic Assemblies
  • Publisher : CRC Press
  • File Size : 29,6 Mb
  • Release Date : 27 February 2004
GET BOOK

This reference provides a complete discussion of the conversion from standard lead-tin to lead-free solder microelectronic assemblies for low-end and high-end applications. Written by more than 45 world-class researchers and practitioners,

Area Array Interconnection Handbook

Area Array Interconnection Handbook
  • Publisher : Springer Science & Business Media
  • File Size : 26,6 Mb
  • Release Date : 06 December 2012
GET BOOK

Microelectronic packaging has been recognized as an important "enabler" for the solid state revolution in electronics which we have witnessed in the last third of the twentieth century. Packaging has

Integrated Circuit Packaging, Assembly and Interconnections

Integrated Circuit Packaging, Assembly and Interconnections
  • Publisher : Springer
  • File Size : 39,7 Mb
  • Release Date : 01 November 2008
GET BOOK

Reviewing the various IC packaging, assembly, and interconnection technologies, this professional reference provides an overview of the materials and the processes, as well as the trends and available options that

Chip On Board

Chip On Board
  • Publisher : Springer Science & Business Media
  • File Size : 20,7 Mb
  • Release Date : 30 June 1994
GET BOOK

This book is a one-stop guide to the state of the art of COB technology. For professionals active in COB and MCM research and development, those who wish to master