Download the fantastic book titled Advances in Chemical Mechanical Planarization CMP written by Babu Suryadevara, available in its entirety in both PDF and EPUB formats for online reading. This page includes a concise summary, a preview of the book cover, and detailed information about "Advances in Chemical Mechanical Planarization CMP ", which was released on 10 September 2021. We suggest perusing the summary before initiating your download. This book is a top selection for enthusiasts of the Technology & Engineering genre.
Summary of Advances in Chemical Mechanical Planarization CMP by Babu Suryadevara PDF
Advances in Chemical Mechanical Planarization (CMP), Second Edition provides the latest information on a mainstream process that is critical for high-volume, high-yield semiconductor manufacturing, and even more so as device dimensions continue to shrink. The second edition includes the recent advances of CMP and its emerging materials, methods, and applications, including coverage of post-CMP cleaning challenges and tribology of CMP. This important book offers a systematic review of fundamentals and advances in the area. Part one covers CMP of dielectric and metal films, with chapters focusing on the use of current and emerging techniques and processes and on CMP of various materials, including ultra low-k materials and high-mobility channel materials, and ending with a chapter reviewing the environmental impacts of CMP processes. New content addressed includes CMP challenges with tungsten, cobalt, and ruthenium as interconnect and barrier films, consumables for ultralow topography and CMP for memory devices. Part two addresses consumables and process control for improved CMP and includes chapters on CMP pads, diamond disc pad conditioning, the use of FTIR spectroscopy for characterization of surface processes and approaches for defection characterization, mitigation, and reduction. Advances in Chemical Mechanical Planarization (CMP), Second Edition is an invaluable resource and key reference for materials scientists and engineers in academia and R&D. Reviews the most relevant techniques and processes for CMP of dielectric and metal films Includes chapters devoted to CMP for current and emerging materials Addresses consumables and process control for improved CMP, including post-CMP
Detail About Advances in Chemical Mechanical Planarization CMP PDF
- Author : Babu Suryadevara
- Publisher : Woodhead Publishing
- Genre : Technology & Engineering
- Total Pages : 650 pages
- ISBN : 0128218193
- Release Date : 10 September 2021
- PDF File Size : 53,8 Mb
- Language : English
- Rating : 4/5 from 21 reviews
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