Failure Modes and Mechanisms in Electronic Packages Book [PDF] Download

Download the fantastic book titled Failure Modes and Mechanisms in Electronic Packages written by P. Singh, available in its entirety in both PDF and EPUB formats for online reading. This page includes a concise summary, a preview of the book cover, and detailed information about "Failure Modes and Mechanisms in Electronic Packages", which was released on 06 December 2012. We suggest perusing the summary before initiating your download. This book is a top selection for enthusiasts of the Technology & Engineering genre.

Summary of Failure Modes and Mechanisms in Electronic Packages by P. Singh PDF

With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive account of the failures of device packages, discrete component connectors, PCB carriers and PCB assemblies.


Detail About Failure Modes and Mechanisms in Electronic Packages PDF

  • Author : P. Singh
  • Publisher : Springer Science & Business Media
  • Genre : Technology & Engineering
  • Total Pages : 391 pages
  • ISBN : 1461560292
  • PDF File Size : 20,9 Mb
  • Language : English
  • Rating : 4/5 from 21 reviews

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Failure Modes and Mechanisms in Electronic Packages

Failure Modes and Mechanisms in Electronic Packages
  • Publisher : Springer Science & Business Media
  • File Size : 54,8 Mb
  • Release Date : 06 December 2012
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With the proliferation of packaging technology, failure and reliability have become serious concerns. This invaluable reference details processes that enable detection, analysis and prevention of failures. It provides a comprehensive

Electronic Materials Handbook

Electronic Materials Handbook
  • Publisher : ASM International
  • File Size : 27,6 Mb
  • Release Date : 01 November 1989
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Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging.

Electronic Failure Analysis Handbook

Electronic Failure Analysis Handbook
  • Publisher : McGraw Hill Professional
  • File Size : 28,9 Mb
  • Release Date : 23 May 1999
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Annotation "In the Electronic Failure Analysis Handbook, you'll find top-to-bottom coverage of this rapidly developing field, encompassing breakthrough techniques and technologies for both components and systems reliability testing, performance evaluation,

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Microelectronics Failure Analysis
  • Publisher : ASM International
  • File Size : 39,8 Mb
  • Release Date : 01 January 2004
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For newcomers cast into the waters to sink or swim as well as seasoned professionals who want authoritative guidance desk-side, this hefty volume updates the previous (1999) edition. It contains the

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ASM Handbook
  • Publisher : Unknown Publisher
  • File Size : 54,9 Mb
  • Release Date : 23 May 1990
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These volumes cover the properties, processing, and applications of metals and nonmetallic engineering materials. They are designed to provide the authoritative information and data necessary for the appropriate selection of

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Accelerated Stress Testing Handbook
  • Publisher : Wiley-IEEE Press
  • File Size : 23,6 Mb
  • Release Date : 25 May 2001
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Electrical Engineering Accelerated Stress Testing Handbook Guide for Achieving Quality Products As we move closer to a genuinely global economy, the pressure to develop highly reliable products on ever-tighter schedules

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ISTFA 2010
  • Publisher : ASM International
  • File Size : 45,6 Mb
  • Release Date : 01 January 2010
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